Epoxy Dispensing & Stamping(Die Bond Tools)

Epoxy Dispensing & Stamping(Die Bond Tools) Epoxy Dispensing and Stamping Semiconductor Tools and Accessories
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Dispensing tools are commonly used for large dies epoxy pattern. This can range from 1x1mm to 50x50mm dies. We supply all types of nozzle patterns to accommodate todays complex die designs. We’ve fabricated some very complex design for special applications. Generally the design and selection of nozzle will depend much on epoxy viscosity and dispensing pattern.

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